Researchers from imec, KU Leuven, Samsung Electronics, and Lam Research published a technical paper titled “Optimization of 3D-DRAM Architecture with Oxide-Semiconductor Channel through Process and Device Simulation.” Abstract Excerpt: “We investigate a monolithically stackable OSC-based 3D-DRAM cell using an integrated framework combining process emulation, TCAD device simulation, parasitic extraction, and analytical modeling.” Find the technic…
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