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Metrology Digs Deep To Produce Next-Generation 3D NAND
Summary by Semiconductor Engineering
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Metrology Digs Deep To Produce Next-Generation 3D NAND
Each generation of 3D NAND packs about 30% more bits than the previous version, with current devices storing up to 2 terabits of data in a die the size of a fingernail. With new product introductions shrinking from 18 months to every 12 months, chipmakers are constantly innovating to enable this prodigious scaling pace. 3D NAND technology is a core ingredient in mobile phones, solid-state drives, data centers, PCs and SD cards. Over 30% of capit…
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