MediaTek launches new mobile chip using TSMC's most advanced technology
- On Tuesday, Taiwan's MediaTek unveiled the Dimensity 9600 Pro, a smartphone chip built on TSMC's 2-nanometer process designed to deliver advanced AI features directly on premium handsets.
- Seeking to challenge U.S. rival Qualcomm, MediaTek raised $3.9 billion last month through a convertible bond sale, with Nvidia investing $3.5 billion and Alphabet participating to support AI infrastructure expansion.
- The new NPU 1090 tech delivers 51% higher large language model prefill performance and 55% higher token generation per watt, while the G2-Ultra NX GPU provides 27% better performance and 24% lower power consumption.
- Corporate senior vice president JC Hsu noted the company is working with handset makers to limit higher component cost effects, while MediaTek also introduced the Dimensity 9600M for broader flagship market segments.
- Facing competition from Qualcomm and the Apple A20 Pro, MediaTek aims to increase flagship market share as the first devices sporting the 9600 Pro launch in the next few months.
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MediaTek goes all-in on flagships with its first 2nm smartphone chip
The company also announced the Dimensity 9600M, a 3nm chip aimed at a wider range of flagship phones. MediaTek said handsets using both processors will launch soon, though it did not identify the manufacturers or provide a specific timeframe.Read Entire Article
The chip, produced with the most advanced TSMC process, will reach Vivo and Oppo's first phones before the end of the year and promises to reduce multinucleus consumption by 61% compared to the previous generation.
The MediaTek Dimensity 9600 Pro is official, here's what it improves over its predecessor
MediaTek releases Dimensity 9600 Pro mobile chip
MediaTek Inc (聯發科) yesterday unveiled a new smartphone chip made using Taiwan Semiconductor Manufacturing Co’s (TSMC, 台積電) most advanced manufacturing technology, targeting the premium handset market with semiconductors capable of running more artificial intelligence (AI) features directly on the de
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