US Edition[Opinion] Hanmi Semiconductor Says Hybrid Bonders Too Costly for HBM4, HBM5 Production
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Examination Of Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM
A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University. Abstract “High-Bandwidth Memory (HBM) enables the bandwidth required by modern AI and high-performance computing, yet its three dimensional stack traps heat and amplifies thermo mechanical stress. We first review how conventional solutions such as heat sp…
Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company defends its market-leading position against rising competition.
[Digital Daily Reporter Ko Seong-hyeon] Chairman Kwak Dong-shin of Hanmi Semiconductor has expressed his opinion that hybrid bonding will not be introduced for the production of next-generation high bandwidth memory (HBM). This is because the thermal compression (TC) bonder can be sufficiently utilized in the upcoming 6th generation (HBM4) and 7th generation (HBM5). On the 15th, Hanmi Semiconductor announced that Chairman Kwak dismissed the opin…
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