8 Articles
8 Articles
From Tool Agents To Flow Agents
Experts At The Table: AI is starting to impact several parts of the EDA design and verification flows, but so far these improvements are isolated to single tool or small flows provided by a single company. What is required is a digital twin of the development process itself on which AI can operate. Semiconductor Engineering sat down with a panel of experts to discuss these issues and others, including Johannes Stahl, senior director of product l…
Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies - Semiconductor Digest
At today's Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power del
Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs
Ansys today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of advanced semiconductor systems for the most demanding applications—including AI chips, graphic processing units (GPUs), and high-performance computing (HPC) products. Intel Foundry and Ansys have also enabled a comprehensive multiphysics signoff an…

Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Synopsys Production-Ready EDA Flows and Broadest IP Portfolio Deliver Leading PPA for Intel Foundry's Advanced Processes and Packaging Technologies
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