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JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs
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JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs
SHENZHEN, China, Jan. 26, 2026 /PRNewswire/ — JarnisTech, a specialized PCB manufacturing and assembly provider, today announced the comprehensive qualification of its Hybrid Lamination Solution. This upgraded capability enables the reliable integration of high-frequency materials (such as Rogers or Taconic) with standard FR-4 within a single multilayer board, directly addressing the cost pressures of mass-market 5G […]
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