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iPhone 18's Advanced A20 Chip Packaging Gains Momentum at TSMC

Summary by MacRumors
Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging method,...

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According to sources close to the supply chain, Apple plans to use TSMC's 2 nanometre engraving technology for its future A20 chip that will equip the iPhone 18 range. This chip would also be associated with a new WMCM encapsulation system (wafer-level multi-chip module), more advanced than InFo (integrated fan-out) technology. [...] Read more... Follow iPhoneAddict.fr on Facebook, and follow us on Twitter Don't forget to download our free iAddi…

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Latestly broke the news in on Sunday, June 22, 2025.
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