Intel moves to chiplets for automotive AI

인텔, 2세대 SDV SoC 공개…차량용 칩 혁신·파트너십 확장

[디지털데일리 김문기 기자] 인텔(CEO 립 부탄)은 ‘상하이 모터쇼 2025’에서 2세대 소프트웨어 정의 차량(Software-Defined Vehicle, SDV)용 시스템온칩(SoC)과 주요 자동차 기술 기업들과의 협업 확대를 발표했다고 24일 발표했다. 2세대 인텔 SDV SoC는 업계 최초로 멀티 공정 노드 기반 칩렛 아키텍처를 채택한 차량용 SoC다. 이 아키텍처는 컴퓨팅, 그래픽, 인공지능(AI) 성능을 필요에 따라 유연하게 구성할 수 있도록 설계됐으며, 완성차 업체에 맞춤형 플랫폼과 확장성을 제공한다. 신형 SoC

Intel Debuts AI-Enhanced SDV SoC with Chiplet Architecture at Shanghai Auto Show

Intel made its first appearance at the Shanghai Auto Show this year, where it unveiled its second-generation AI-enhanced software-defined vehicle (SDV) SoC featuring chiplet architecture—a first in the automotive industry. This expansion of Intel’s product portfolio demonstrates its growing commitment to the intelligent cockpit space. Industry analysts speculate this new SoC may be derived from […] The post Intel Debuts AI-Enhanced SDV SoC with …

Intel moves to chiplets for automotive AI

Intel has taken a key step in using chiplets for its second generation software-defined vehicle system-on-chip (SoC) device. The SoC, launched at the Shanghai 2025 Auto Show overnight, combines chiplets built on different process technologies to provide large language model AI support and more graphics support for user interfaces as well as 12 camera channels […] The post Intel moves to chiplets for automotive AI appeared first on eeNews Europe.