Infineon Launches Next-Gen Power Chips to Boost Efficiency and Performance in Electric Vehicles
2 Articles
2 Articles
Infineon Launches Next-Gen Power Chips to Boost Efficiency and Performance in Electric Vehicles
Infineon Technologies has unveiled a new generation of high-voltage power semiconductors designed to significantly enhance the efficiency, performance, and power density of electric vehicles (EVs) and plug-in hybrids. The new product lineup includes third-generation Electric Drive Train (EDT3) chips and Reverse Conducting Insulated Gate Bipolar Transistors (RC-IGBTs), both engineered to meet the evolving demands of [...] The post Infineon Launch…
Infineon introduces new generation EDT and IGBT chips – Telematics Wire
Press Release, 17 April 2025 Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the EDT3 (Electric Drive Train, 3 rd generation) chips, designed for 400V and 800V systems, and the RC-IGBT(Reverse Conducting Insulated Gate Bipolar Transistor) chips, tailored specifically for 800 V systems. The EDT3 and RC-IGBT bare dies have been engineered to deliver high-quality and reliable performance, empowering customers to create custom power …
Coverage Details
Bias Distribution
- There is no tracked Bias information for the sources covering this story.
To view factuality data please Upgrade to Premium
Ownership
To view ownership data please Upgrade to Vantage