Hongyuan rolls out 40 µm ‘engineering-ready’ ultra-thin silicon wafers

Hongyuan rolls out 40 µm ‘engineering-ready’ ultra-thin silicon wafers

Hongyuan Green Energy says it has produced a first batch of 40 µm monocrystalline silicon wafers that support full-size and half-cut formats, with slicing completed using the company’s in-house wafering equipment.Hongyuan Green Energy said it has produced a first batch of 40 µm ultra-thin monocrystalline silicon wafers at its smart wafer manufacturing base in Baotou, China, marking what it describes as a production-oriented step in wafer thinnin…