US EditionPublished • loading... • Updated
Hongyuan Launches 40 μM Ultra-Thin Silicon Wafers for Use in Engineering
Summary by Pv-Magazine-latam.com
This story is only covered by news sources that have yet to be evaluated by the independent media monitoring agencies we use to assess the quality and reliability of news outlets on our platform. Learn more here.1 Articles
1 Articles
Hongyuan Green Energy claims to have produced a first batch of 40 μm single-crystalline silicon wafers compatible with full size and half-cut formats, which has been cut with the company’s own wafer cutting equipment. Hongyuan Green Energy has announced that it has produced a first batch of 40 μm ultra-thin monocrystalline silicon wafer wafers at its smart wafer manufacturing base in Baotou, China, which, according to the company, is a productio…
Coverage Details
Total News Sources1
Leaning Left0Leaning Right0Center0Last UpdatedBias DistributionNo sources with tracked biases.
Bias Distribution
- There is no tracked Bias information for the sources covering this story.
Factuality
To view factuality data please Upgrade to Premium
