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Hanmi Semiconductor, Tes and Developing 'Hybrid Bonder'… Expanding the Front-End Equipment Outline

Summary by ddaily.co.kr
[Digital Daily Reporter Bae Tae-yong] Hanmi Semiconductor is joining hands with TES to develop hybrid bonder equipment, a key technology for next-generation semiconductor packaging. As Hanmi Semiconductor, which is ranked first in the world in the bonder market for HBM (high bandwidth memory), expands its business area to the front-end equipment sector, the synergy of the two companies' technology convergence is drawing attention. On the 23rd, H…
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ddaily.co.krddaily.co.kr

Hanmi Semiconductor, Tes and Developing 'Hybrid Bonder'… Expanding the Front-End Equipment Outline

[Digital Daily Reporter Bae Tae-yong] Hanmi Semiconductor is joining hands with TES to develop hybrid bonder equipment, a key technology for next-generation semiconductor packaging. As Hanmi Semiconductor, which is ranked first in the world in the bonder market for HBM (high bandwidth memory), expands its business area to the front-end equipment sector, the synergy of the two companies' technology convergence is drawing attention. On the 23rd, H…

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ddaily.co.kr broke the news in on Wednesday, July 23, 2025.
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