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From Chip-Making to 3D: Utah’s Single-Exposure Printing Method

Engineers at the University of Utah have shown off a 3D printing approach that sidesteps one of the format’s persistent weaknesses: the leaky seams left behind when an object is built up slice by slice. Rather than stacking layers, the technique relies on a nanoscale “mask” that bends laser light into a holographic version of…

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3D Printing Industry broke the news on Tuesday, July 14, 2026.
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