US EditionDeca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America - Semiconductor Digest
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Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America - Semiconductor Digest
Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec.
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