US EditionDeca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America - Semiconductor Digest
Summary by Semiconductor Digest
This story is only covered by news sources that have yet to be evaluated by the independent media monitoring agencies we use to assess the quality and reliability of news outlets on our platform. Learn more here.1 Articles
1 Articles
All
Left
Center
Right
Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America - Semiconductor Digest
Deca Technologies today announced the signing of an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec.
Coverage Details
Total News Sources1
Leaning Left0Leaning Right0Center0Last UpdatedBias DistributionNo sources with tracked biases.
Bias Distribution
- There is no tracked Bias information for the sources covering this story.
Factuality
To view factuality data please Upgrade to Premium
