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Chip Industry Week In Review

Summary by Semiconductor Engineering
$2B foundry pact; hyper-NA EUV; TSMC, Samsung financials; Canon readies nanoimprint; AI chips under scrutiny; $10T data center buildout; $1.5B SiC boost; chip smuggling; 800V power gains traction; quantum HW scales up; wireless EV road charging; sub-nm gate dielectrics; mobile fab.
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Semiconductor EngineeringSemiconductor Engineering

Chip Industry Week In Review

$2B foundry pact; hyper-NA EUV; TSMC, Samsung financials; Canon readies nanoimprint; AI chips under scrutiny; $10T data center buildout; $1.5B SiC boost; chip smuggling; 800V power gains traction; quantum HW scales up; wireless EV road charging; sub-nm gate dielectrics; mobile fab.

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Semiconductor Engineering broke the news on Friday, October 9, 2026.
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