TSMC Reportedly Weighs Another CoWoS Price Hike of up to 20% as AI Chip Demand Keeps Growing
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6 Articles
TSMC reportedly weighs 20% CoWoS price increase as Nvidia Blackwell and Rubin chips put pressure on packaging capacity — equipment lead times stretch to eight months
TSMC is reportedly weighing a price increase of up to 20% for its CoWoS advanced packaging technology as Nvidia’s Blackwell and upcoming Rubin chips intensify pressure on capacity. Equipment deliveries now reportedly take up to eight months, while separate wafer-price increases of 5% to 10% are expected in 2027, with some customers potentially facing total cost increases of up to 25%.
Demand & Complexities Of AI GPUs And Custom ASICs Have Stressed TSMC’s CoWoS Supply, Reportedly Sparking The Possibility Of A 20% Price Hike
TSMC’s CoWoS advanced packaging technology could witness another price increase, with supply chain sources suggesting a hike of up to 20 percent being discussed. The potential premium expected to be slapped on the packaging stems from demand adjustment, as AI chips are pushing the Taiwanese giant’s technology to its limits, with some lead times already lengthened. As more compute dies and HBM stacks are added on a single package, the more comple…
According to ChainCatcher and the Commercial Times, supply chain sources indicate that TSMC is preparing for another round of price increases for its CoWoS (CoWave System), with the increase expected to reach 20%. Lead times for some packaging projects have already lengthened, and the pressure of tight capacity continues to rise. This capacity-grabbing effect has spread to the equipment sector, where customers are no longer willing to negotiate …
A report attributed to Crypto Briefing points out that TSMC would be considering raising the price of its CoWoS services between 10% and 20%, key to assemble some artificial intelligence accelerators. The above estimates point to an expansion of capacity, although the supply could remain under pressure and the bottleneck would continue until 2028.
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