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Apple And NVIDIA To Turn Into Rivals Over TSMC Advanced Packaging With The M5 Ultra Or M6 Ultra Chip
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Apple And NVIDIA To Turn Into Rivals Over TSMC Advanced Packaging With The M5 Ultra Or M6 Ultra Chip
Up until recently, Apple and NVIDIA maintained neat and clearly delineated orbits within TSMC's sprawling fabs, with the former leveraging the fab giant's leading-edge process and InFO (Integrated Fan-Out) packaging tech for its A-series processors, while the latter continuing to utilize TSMC's older-gen process alongside CoWoS (Chip-on-Wafer-on-Substrate) packaging technology for its GPUs. Yet, as both Apple and NVIDIA adopt a more aggressive d…
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