US EditionSamsung Elec and AMD Sign MoU on AI Memory, Explore Foundry Partnership
Samsung will supply high-bandwidth memory for AMD's AI GPUs and collaborate on DDR5 memory and advanced packaging to enhance AI data center performance.
- On Wednesday, Samsung Electronics signed a memorandum of understanding with Advanced Micro Devices Inc. to supply HBM4 memory for the U.S. firm's Instinct MI455X graphics processing unit.
- The partnership builds on a long-standing relationship where Samsung supplied GDDR DRAM for AMD graphics cards; AMD CEO Lisa visited South Korea to finalize the new deal arrangement.
- Samsung's HBM4 utilizes a 4-nanometer logic process on the base die, enabling data transfer speeds of up to 13 Gbps and bandwidth of up to 3.3 Tbps.
- Beyond HBM4, the two companies will collaborate on DDR5 memory solutions for AMD's Helios platform and expand cooperation into advanced foundry and packaging services.
- "Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD's evolving AI roadmap," said Vice Chairman Jun Young-hyun, reflecting shared commitment to advancing AI computing.
21 Articles
21 Articles
Samsung Elec and AMD sign MoU on AI memory, explore foundry partnership
Samsung Electronics and Advanced Micro Devices (AMD) signed a memorandum of understanding to expand their strategic partnership on memory chip supplies for artificial intelligence infrastructure, the companies said on Wednesday.
Samsung, AMD expand partnership to supply HBM4 chips for AI
Samsung Electronics, and Advanced Micro Devices (AMD), signed a memorandum of understanding to expand their strategic partnership on memory chip supplies for artificial intelligence infrastructure, the companies said on Wednesday. The agreement will focus on supplying Samsung's next-generation high-bandwidth memory (HBM4) for AMD's upcoming Instinct MI455X AI accelerators, as well as optimised DDR5 memory for AMD's sixth-generation EPYC proce…
Samsung Electronics Selected as Preferred Supplier for AMD HBM4; Pursuing Foundry Cooperation. Samsung Electronics Signed MOU with AMD on the 18th. Samsung Electronics has been selected as the preferred supplier of 6th Generation High Bandwidth Memory (HBM4) for AMD's next-generation AI chips. Regarding cooperation with AMD in foundry semiconductor contract manufacturing...
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