US Edition"3d Integration Is a Great Opportunity for Europe
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Semi-association has brought Europe's top microelectronics specialists to Dresden at the 3D & Systems Summit 2025. Dresden, 26 June 2025. The trend towards heterogeneous 3D chips offers France, Germany and other European countries unique opportunities to occupy new positions in global microelectronics. This was predicted by Director Sébastien Dauvé of the French Semiconductor Research Center "Cea Leti" during the conference "Semi 3D & Systems Su…
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