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TSMC SoW-X: when silicon is not enough and packaging is the true innovation in chips
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Wafers make it possible to produce single chips but to meet the needs of IA data centers, it is tempting to turn wafers into giant chips. TSMC prepares the technology to propose this innovation to all.
Do you remember the Tesla Dojo? It was something we talked about almost a year ago, where the company intends to unite 25 CPUs in 1 to create the largest AI processor in history dedicated to training its algorithms for their cars. At that time we already talked about the technology they would use to achieve it, and how TSMC would make it possible: InFO-SoW. Well, the Taiwanese company has given a few more data about what it will be, and it will …
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