TSMC's Advanced Packaging Production Lines Are So ‘Bottled Up’ That the Firm Is Now Looking to Outsource Orders to Meet Demand

TSMC's Advanced Packaging Facilities Reportedly at Max. Capacity, Insiders Whisper About Outsourcing

Over the past weekend, Taiwanese semiconductor industry moles alleged that the nation's leading foundry service is considering external advanced packaging production avenues. According to UDN Money, TSMC's "entire CoWoS series of advanced packaging products" are fully booked up—with plenty of demand coming from the usual big AI hardware players. Various flavors of Chip-on-Wafer-on-Substrate (CoWoS) exist, including the currently vaunted CoWoS-L …

TSMC's Advanced Packaging Production Lines Are So ‘Bottled Up’ That the Firm Is Now Looking to Outsource Orders to Meet Demand

TSMC's advanced packaging capacity is 'fully booked' at the moment, which is a huge concern for the AI industry, but it appears that the Taiwan giant has a strategy in sight. TSMC's 'CoWoS' Production Lines Have No Room For Further Orders, As the Firm Now Relies on Outsourcing Advanced packaging has been the 'holy grail' for manufacturers when it comes to combining multiple chiplets to scale up the performance of their AI chips, which is why sol…