US EditionTsmc's 2nm Production Capacity Is Fully Booked Ahead of Schedule; Advanced Packaging and Testing Companies Follow Suit with Capacity Expansion
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Recent market reports indicate that TSMC's 2nm process capacity has been pre-booked by customers until 2027, with artificial intelligence (AI) continuing to drive explosive demand for advanced processes. As front-end processes are in short supply, Taiwanese packaging and testing companies are simultaneously accelerating their investment and deployment, creating a semiconductor supply chain expansion boom.
TSMC continues to expand its advanced manufacturing processes in Taiwan. Industry experts estimate that nearly 80% of TSMC's advanced manufacturing processes will remain in Taiwan over the next five years. This includes Taiwanese packaging and testing companies such as ASE Technology Holding, Powertech Technology, SPIL, and King Yuan Electronics, as well as testing interface companies such as Ingenic Semiconductor and Precision Test Systems. Thi…
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