Tsmc Expands Advanced Packaging Process… Builds Two New Factories

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TSMC to Establish Two New Plants for Advanced Packaging Process Expansion Taiwanese foundry semiconductor contract manufacturer TSMC has set out to expand its advanced packaging AP (Application Processor) manufacturing process. According to Taiwanese media outlets such as the Commercial Times and the Economic Daily on the 13th, TSMC is expected to disclose related plans at its first-quarter earnings conference scheduled for the 16th...

cna.com.tw

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TSMC (2330), the world's leading semiconductor foundry, will hold an investor conference on the 16th, with its advanced packaging strategy being a key focus. Market assessments indicate that TSMC plans to transform its existing 8-inch wafer fabs in Taiwan into advanced packaging facilities, with existing packaging and testing plants supporting 2-nanometer advanced processes. Chiayi and Tainan will become new packaging and testing hubs. Furthermo…