US EditionTSMC Plans CoPoS and SoIC Advanced Packaging for Arizona Fab
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TSMC Plans CoPoS and SoIC Advanced Packaging for Arizona Fab
TSMC plans to expand its Arizona facility with advanced packaging by constructing two dedicated buildings near to its Fab 21 complex. The first, Advanced Packaging Facility 1 (AP1), is slated to break ground in 2028 alongside Phase 3 of Fab 21, which will eventually produce chips on the N2 (2 nm) node and potentially the A16 process. A second structure, AP2, will follow in tandem with later expansions (Phases 4 and 5), though exact dates remain …
To date, TSMC has issued the stipulation that modern chips may also be manufactured outside Taiwan in its own Fabs, but the most modern processes are only available from the home country.
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