Teramount Raises $50M to Advance Optical Connectivity Solutions for AI

Teramount raises $50M to advance optical connectivity solutions for AI

Israeli company Teramount’s TeraVerse solution is a detachable, serviceable connector that links optical fibers coming from outside the rack to the silicon photonics chips inside Co-Packaged Optics (CPO) systems.

Teramount Raises $50M for Optical Connectivity from AMD, Hitachi, Samsung, Koch

Jerusalem, July 29, 2025 — Teramount, a company focused on fiber-to-chip interconnect solutions, announced it has raised $50 million in financing led by new investor Koch Disruptive Technologies (KDT). Existing investors Grove Ventures and several new strategic investors, including AMD Ventures, Hitachi Ventures, Samsung Catalyst Fund and Wistron, joined the round. To meet AI’s escalating […] The post Teramount Raises $50M for Optical Connectivi…