AI Memory, Chip Stocks Largely Show Gains After Sandisk's Results
5 Articles
5 Articles
Chip Industry Week in Review
Memory/FMS Denser, faster, and more distributed memory architectures for AI was the big news at the Future of Memory and Storage conference this week: Sandisk and SK hynix released the High Bandwidth Flash (HBF) spec, outlining basic performance expectations, the xPU-HBF host interface, and reliability and packaging guidance for an HBF die stack. Samsung showed concept models of zHBM, which vertically stacks HBM directly above AI accelerators, …
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- 34% of the sources lean Left, 33% of the sources are Center, 33% of the sources lean Right
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