Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push
The five-year memorandum covers HBM4 and HBM4E memory, two-nanometer foundry work and advanced packaging as AI chip demand accelerates.
- On Friday, Samsung Electronics and Broadcom signed a non-binding memorandum of understanding worth more than $200 billion for AI semiconductors, covering memory, foundry, and advanced packaging through 2030.
- Broadcom seeks supply chain resilience beyond its heavy reliance on TSMC, which controls more than 90 percent of leading-edge chip production; Samsung's foundry market share has fallen to roughly seven percent, creating mutual benefit.
- Samsung will supply Broadcom with next-generation HBM4 and HBM4E memory chips for AI accelerators and manufacture Broadcom products using two-nanometer process technologies at its Pyeongtaek campus in South Korea.
- The partnership was announced at an AI summit hosted by South Korean President Lee Jae Myung as part of a broader $950 billion package of semiconductor deals between South Korean and American companies.
- Samsung posted record quarterly operating profit of 89 trillion won in Q2, driven by AI memory demand, positioning the company to execute intensive R&D alongside Broadcom's custom AI chip designs for Google and Meta.
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Samsung, Broadcom Expand AI Semiconductor Partnership; Collaboration Estimated at over $200 Bn Through 2030
Get latest articles and stories on Business at LatestLY. Samsung Electronics and Broadcom on Saturday signed a memorandum of understanding (MoU) to expand their strategic collaboration across memory and foundry technologies, with the partnership expected to be worth more than USD 200 billion over the next five years through 2030. Business News | Samsung, Broadcom Expand AI Semiconductor Partnership; Collaboration Estimated at over $200 Bn Throug…
Samsung Elec wins $200 billion Broadcom AI chip partnership, boosting foundry push
Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030.
Samsung Electronics Joins Hands with Broadcom for AI Semiconductors... 290 Trillion Won Cooperation Over 5 Years. Samsung Electronics has agreed to collaborate with the U.S. semiconductor design firm Broadcom in the field of artificial intelligence semiconductors for the next five years, until 2030, with a scale worth $200 billion (approximately 290 trillion won). In the global industry, regarding custom AI chips...
(Seoul = Yonhap News) Reporter Kang Tae-woo = Samsung Electronics [005930] has entered into a $200 billion (approximately 290 trillion won) advanced... deal with U.S. semiconductor design company Broadcom over the next five years
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