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Nvidia Feynman Pushes TSMC A16 and CPO Ramp

Summary by technewstube.com
Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin enters mass production and ramps up. The move is set to drive upgrades at TSMC and could trigger another wave of orders across the global equipment and materials supply chain.

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NVIDIA is still deploying Vera Rubin, but the company would already be mobilizing its supply chain to prepare for the next generational leap, and apparently it will be monstrous. We are talking about NVIDIA Feynman, a platform planned for the second half of 2028 that would combine the lithographic process of TSMC, specifically A16, 3D chiplet stacking, custom HBM memory and optical connections integrated through CPO.

As the Blackwell GPUs continue their deployment and future generations Rubin and Rubin Ultra have not yet made their commercial debut, NVIDIA would already be working on their successor. According to several sources close to the TSMC supply chain, Jensen Huang's company has launched the prototyping of its next architecture called Feynman, [...] The NVIDIA article is already preparing the post-Rubin: Feynman architecture would adopt the TSMC A16 …

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BITRSS broke the news on Friday, August 14, 2026.
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