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NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production
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NHanced Semiconductors Leads the Semiconductor Industry in Heterogeneous Hybrid Bonding Production
MORRISVILLE, NC (DECEMBER 16, 2025) – NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, uniquely supports mixed-material hybrid bonding with either copper or nickel bonds. Their new Besi bonding system further expands its advanced packaging yield and throughput. NHanced announced earlier this year that it had taken delivery of the first BE Semiconductor Industries (Besi) Datacon 8800 CHAMEOultra plus hybrid bondi…
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