New Keysight software targets 3D chiplet bottlenecks in AI data centers

Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs

SANTA ROSA, Calif.–(BUSINESS WIRE)–Keysight Technologies, Inc. (NYSE: KEYS) today introduced 3D Interconnect Designer, a new addition to its Electronic Design Automation (EDA) portfolio. The solution addresses the mounting complexity of designing 3D interconnects for high-chiplet and 3DIC advanced packages used in AI infrastructure and data center applications. As chiplet architectures are increasingly adopted, engineers face complex 3D intercon…

New Keysight software targets 3D chiplet bottlenecks in AI data centers

Automation, EM simulation and UCIe/BoW checks aim to cut chiplet 3D interconnect design spins and delays in AI infrastructure and data center packages.