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Cost Effective Method Developed for Co-Packaging Photonic and Electronic Chips

CAMBRIDGE, MASSACHUSETTS, JUL 28 – MIT researchers created a cost-effective method to integrate photonic and electronic chips using existing electronics foundry equipment, improving alignment tolerance and energy efficiency, researchers said.

Summary by TechXplore
The future of digital computing and communications will involve both electronics—manipulating data with electricity—and photonics, or doing the same with light. Together the two could allow exponentially more data traffic across the globe in a process that is also more energy efficient.

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TechXplore broke the news in on Monday, July 28, 2025.
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