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Micron Breaks Ground on Hiroshima Expansion to Boost AI Memory Chip Production

The $9.3 billion project will add capacity for high-bandwidth memory chips used in AI processors, with shipments expected to start in summer 2028.

  • On Saturday, Micron Technology broke ground on a major expansion of its Hiroshima factory, a 1.5 trillion yen project to produce advanced high-bandwidth memory for AI servers.
  • Japan's Ministry of Economy, Trade and Industry is providing up to 536 billion yen in support, aiming to rebuild its domestic semiconductor base amid U.S.-China technology competition.
  • During the ceremony, Micron CEO Sanjay Mehrotra said, "Micron's very first HBM production wafer for the memory technology at the heart of AI was made right here in Hiroshima."
  • Japan's backing of Micron raises a new challenge to South Korea's lead in high-bandwidth memory, as established rivals Samsung and Hynix Inc boost capacity.
  • Micron plans to begin installing manufacturing equipment in the second half of 2028, positioning the Hiroshima facility to meet rapidly growing demand for semiconductors in the AI era.
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Micron continues to expand its investments in its own storage production within Japan.

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NHK World broke the news in Tokyo, Japan on Saturday, July 4, 2026.
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