Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking

Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures

60-Micron Ultra-Thick Film Technology: Lam Research's New VECTOR TEOS 3D Revolutionizes AI Chip Packaging

New deposition tool enables 60-micron thick inter-die films for advanced chiplet architectures, delivering 70% faster throughput and 20% better cost efficiency. Targets AI and HPC applications.