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Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
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Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
Research on optoelectronic integration - referring to the application of optical communication technology to computing - is gaining momentum. Its semiconductor packaging component officially got underway in April 2026 in Chitose City, Hokkaido, Japan, where Rapidus's semiconductor factory is located. The project is led by the Leading-edge Semiconductor Technology Center (LSTC), with participation from Rapidus and other organizations, and has est…
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