Intel Might Have Gained Ground on TSMC's Packaging Dominance as Booming AI Demand Overwhelms the Industry's Undisputed Leader
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According to ChainCatcher, citing the Economic Daily News, TSMC's advanced packaging CoWoS capacity is in short supply. Industry sources indicate that some back-end orders have spilled over to Intel's Malaysian plant, with Intel contributing some of its capacity to assist in packaging for a common major client, breaking with past ecosystem competition practices. TSMC Chairman C.C. Wei previously stated at an earnings call that TSMC focuses on fr…
Intel Might Have Gained Ground on TSMC's Packaging Dominance as Booming AI Demand Overwhelms the Industry's Undisputed Leader
With the demand for its CoWoS chip packaging technology booming, TSMC might be losing some market share to Intel, suggests data from SemiAnalysis Chipbook. CoWoS, which is short for chip-on-wafer-on-substrate (CoWoS), is a key step in the AI chip manufacturing process. It involves combining multiple GPUs and memory chips in a single package, which is then used in a data center or other computing infrastructure. Export Data Suggests Intel Might B…
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