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AMD Could Become a Customer of Intel EMIB-T Packaging Business

Summary by Guru3D.com
AMD could become an external customer of Intel Foundry’s EMIB-T advanced-packaging technology, according to analysis attributed to UBS. The report places AMD alongside Google, Apple and SpaceX as potential users of Intel’s packaging capacity.
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According to an analysis relayed by the UBS investment bank, AMD could soon become a customer of Intel Foundry for the manufacture or assembly of some of its future products. Such an evolution would have been difficult to imagine a few years ago, as the rivalry between the two companies is rooted in the semiconductor industry. [...] The AMD article could entrust some of its chips to Intel Foundry: an unexpected rapprochement against the limitati…

News from HD Technology. Visit www.hd-tecnologia.com for the latest news. AMD could end up using Intel Foundry to manufacture or package future advanced chips, according to UBS analysts. The movement would be striking because of the historic rivalry between the two companies, but it would respond to a specific reason. TSMC’s capacity limitations would be pushing large techs to look for alternatives for their next products. AMD would be among pot…

According to the UBS financial services multinational, AMD will end up using Intel Foundry to help you make future chips. This move is being made to beg because of the historical rivalry that exists between the two companies. In this case, AMD would be admitting that Intel Foundry is a smelter with enough level to manufacture major AMD chips, specifically its CPUs for EPYC servers or IA/GPU Instinct accelerators. According to UBS analysts, TSMC’…

According to analysts from the Swiss major bank UBS, AMD is expected to stand before awarding manufacturing orders for certain chips to the foundry division of its competitor Intel. It is said that this is the way to develop new capacities away from TSMC. (Continue reading)

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winfuture.de broke the news on Friday, August 14, 2026.
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