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IBM and Deca to launch advanced chip packaging in Quebec

Summary by evertiq.com
Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec. Under the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT).
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evertiq.com broke the news in on Thursday, May 22, 2025.
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