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Hackster launches Build the Autodesk University 2027 Product design challenge
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Hackster launches Build the Autodesk University 2027 Product design challenge
Hackster.io, an Avnet community, in partnership with Autodesk, Arduino, Qualcomm and PCBWay, has launched a new competition challenging developers, engineers and makers to design the next official product for Autodesk University 2027. The winning concept will be manufactured and distributed to approximately 750 attendees at Autodesk University 2027. Using Autodesk Fusion, the Arduino® UNO Q and support from PCBWay, participants are invited to cr…
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