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Samsung and SK Hynix upgrading China plants to make more advanced chips: Reuters
The upgrades would lift output to more than 200 layers as the companies seek to match South Korean production and counter YMTC’s gains, Reuters said.
On Tuesday, October 21, Samsung Electronics and SK Hynix confirmed they are upgrading Chinese NAND memory factories to produce more advanced chips, aiming to meet rising global artificial intelligence demand.
These upgrades proceed despite strict U.S. export controls imposed since 2022, which require the South Korean chipmakers to seek annual licenses for U.S.-made equipment, according to the Commerce Department's Bureau of Industry and Security.
Yangtze Memory Technologies captured 38.5% of China's NAND market in the second quarter, up from 28% in 2025, while Samsung's share fell to 33.5% from 36% and SK Hynix's dropped to 17% from 20%, according to research firm Omdia.
Samsung is converting its Xian plant to manufacture 286-layer V9 NAND chips, targeting 5,000 wafers monthly by December this year and 40,000 by December 2027, while SK Hynix plans to shift its Dalian facilities to 240-layer production.
Separately, SK Hynix is in discussions with the Trump administration regarding plans to build a new NAND factory in the United States, potentially leveraging research from its Solidigm business unit acquired from Intel in 2021.
Samsung and SK Hynix are upgrading their NAND factories in China to compete with YMTC and respond to AI-related storage demand. The strategy coincides with changes in Chinese market shares and US controls that make relevant the scope of licenses to import equipment.