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CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch
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CEA-Leti Presents Die-to-Wafer Hybrid Bonding At 1 μm Pitch
CEA-Leti today announced a major milestone in the evolution of 3D integration for high-performance computing (HPC), advanced smart-vision systems and artificial intelligence (AI), demonstrating a functional test vehicle utilizing die-to-wafer (D2W) hybrid bonding with pitches down to 1 μm.
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