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CDI For The Metrology Of Copper Pads Used In Hybrid Bonding (Paul Scherrer Institute, Samsung)
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CDI For The Metrology Of Copper Pads Used In Hybrid Bonding (Paul Scherrer Institute, Samsung)
A new technical paper titled “Coherent diffractive imaging simulations for wafer inspection of periodic structures” was published by researchers at the Paul Scherrer Institute and Samsung. Excerpt “We present a study of phase retrieval algorithms applied to the metrology of copper pad topography for hybrid bonding. We demonstrate that by including a priori information in the update function of the object, a better estimation of the recession of …
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