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Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market

Summary by techpowerup.com
Cadence today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, and high-performance computing (HPC) applications. Initial IP partners joining Cadence include Arm, Arteris, eMemory, M31 Technology, Silicon Creations and Trilinear Technologies, as well as silicon analytics partner proteanTecs. To help reduce risk…

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The Bakersfield Californian broke the news in Bakersfield, United States on Tuesday, January 6, 2026.
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