Cadence expands TSMC partnership to power next-gen AI chips

Cadence expands TSMC partnership to power next-gen AI chips

Cadence expands TSMC partnership for AI/HPC chip design, certifying tools for A14 and N2P plus 3D-IC packaging.

Cadence Locks In TSMC A14 Tool Certification, Cutting Design Iterations By 2.5X As It Races Toward Agentic AI Chips

Cadence and TSMC are expanding their collaboration by achieving tool certification for the next-gen A14 process technology. Cadence Achieves TSMC A14 Tool Certification, Enabling Agentic AI Chip & 3D-IC Design Flows Across N3, N2, A16, A14 and 3DFabric Processes Press Release: Cadence today announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers. Cadence has achieved tool certification for TSMC’s adv…