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Brewer Science Participating in the Next-Generation Semiconductor Packaging Consortium "JOINT3"
Summary by Semiconductor Digest
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1 Articles
Brewer Science Participating in the Next-Generation Semiconductor Packaging Consortium "JOINT3"
JOINT3 is a co-creation evaluation platform established by Resonac Corporation with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies. JOINT3 brings together global leaders in semiconductor materials, equipment, and design. Using a prototype line for 515 x 510-mm panel-level organic interposers, the …
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