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Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X

Summary by techpowerup.com

Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx die-to-die (D2D) PHY on Samsung Foundry's SF4X 4 nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while achieving industry-leading silicon area footprint and power consumption. BlueLynx D2D subsystem IP enables chip architects to meet the bandwid…

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talkdev.com

Blue Cheetah Tapes Out Chiplet Interconnect on SF4X

Blue Cheetah Analog Design today announced the successful tape-outs of its next generation BlueLynx die-to-die (D2D) PHY on Samsung Foundry’s SF4X 4nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbps while achieving industry-leading silicon area footprint and power consumption. BlueLynx D2D subsystem IP enables chip architects to meet the bandwidt…

1 month ago

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eeNews Europe

Blue Cheetah tapes out 100Tbit/s chiplet interconnect on Samsung 4nm

Blue Cheetah Analog Design has taped outs designs of its next generation BlueLynx die-to-die (D2D) chiplet PHY on Samsung Foundry’s SF4X 4nm advanced manufacturing process. The latest PHY supports both advanced and standard chiplet packaging with an aggregate throughput exceeding 100 Tbit/s. The PHY supports Universal Chiplet Interconnect Express (UCIe) and the Open Compute Project […] The post Blue Cheetah tapes out 100Tbit/s chiplet interconne…

1 month ago

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