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Besi shares fall on report ASML is working on rival hybrid bonding product
SemiAnalysis said ASML filed 27 hybrid bonding patents, raising concerns that the new tool could challenge Besi’s main growth product.
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WTVBBesi shares fall on report ASML is working on rival hybrid bonding product
AMSTERDAM, Oct 16 : Shares in computer chip packaging equipment maker BE Semiconductor Industries (Besi) fell 3 per cent on Friday after influential semiconductor research firm SemiAnalysis reported that one of the company's main growth products will face competition from bigger rival ASML.The SemiAnalysis r
·Singapore, Singapore
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ASML would be exploring activities beyond lithography: SemiAnalysis identified 27 patent families on hybrid bonding tools, a packaging technique that connects chips or wafers directly and that, according to reports, also adopt Chinese companies.
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