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ASML unveils EUV light source advance that could yield 50% more chips by 2030

ASML's new EUV machine power boost could lower chip costs and increase output by 50% by 2030, securing its lead against US and Chinese competitors.

  • On Feb 23, ASML Holding disclosed a technical advance boosting EUV light-source power to 1,000 watts from 600 watts, reported first from San Diego, California.
  • The development addresses the core challenge of EUV light generation as ASML, the sole commercial supplier to TSMC and Intel, seeks greater power to boost chip output and cut costs.
  • Doubling tin drops to about 100,000 per second and shaping plasma with two smaller laser bursts produced 13.5 nanometre EUV light collected by Carl Zeiss AG, shortening exposure times.
  • Industry experts say the advance builds on extremely complex systems as U.S. startups Substrate and xLight raised hundreds of millions, with xLight gaining funding from President Donald Trump’s administration.
  • ASML says the techniques should enable further advances as U.S. export restrictions have pushed China’s national effort to build EUV machines, with wafers holding scores to thousands of devices affecting supply.
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The company believes there is a clear path to increasing EUV power to 1,500 and even 2,000 watts in the future, which would further increase efficiency and chip production capacity.

·Belgrade, Serbia
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The Dutch production of litography machines revealed an innovation in the ultraviolet light source that promises to speed up the manufacturing rate of semiconductors.

·Portugal
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Reuters broke the news in United Kingdom on Monday, February 23, 2026.
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