ASML, TSMC, and imec move 2D transistors closer to manufacturing reality

ASML, TSMC, and imec move 2D transistors closer to manufacturing reality

ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly pitch (CPP), marking the first time such scaled d…

Imec, ASML and TSMC develop integration route for 2D-material based nFETs and pFETs

Imec, ASML and TSMC have come up with a novel, robust and scalable 300mm integration route for 2D-material based n and pFETs. For the first time, scaled nFETs (implementing MoS2 ... The post Imec, ASML and TSMC develop integration route for 2D-material based nFETs and pFETs appeared first on Electronics Weekly.