Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging ...

Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging ...

Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in SingaporeExpanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications…

Applied Materials, Besi Expand Advanced Packaging Partnership for AI Scaling

Besi joins Applied's EPIC Center as an Innovation Partner, extending a collaboration that began in 2020 with the companies' joint Hybrid Bonding Center of Excellence in Singapore.

Applied Materials and Besi expand partnership to push AI chip packaging forward

Applied Materials and Besi expand their hybrid bonding partnership as Kinex lands an SK hynix HBM order and AI chip packaging demand grows.