US EditionPublished • loading... • Updated
AEMC joint venture to build semiconductor adhesives R&D center in Southern Taiwan Science Park
Summary by technewstube.com
This story is only covered by news sources that have yet to be evaluated by the independent media monitoring agencies we use to assess the quality and reliability of news outlets on our platform. Learn more here.1 Articles
1 Articles
AEMC joint venture to build semiconductor adhesives R&D center in Southern Taiwan Science Park
Shin Bao Hong Technology (transliteration), a joint venture backed by three Taiwanese firms: Advanced Echem Materials (AEMC), Nan Pao Resins Chemical Group, and Trusval Technology, applied to establish a branch at the Tainan campus of the Southern Taiwan Science Park, where it plans to build an advanced research and development center focused on adhesive materials used in semiconductor manufacturing processes.
Coverage Details
Total News Sources1
Leaning Left0Leaning Right0Center0Last UpdatedBias DistributionNo sources with tracked biases.
Bias Distribution
- There is no tracked Bias information for the sources covering this story.
Factuality
To view factuality data please Upgrade to Premium
